Electronics Forum: btc and voids (Page 5 of 6)

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

Void under QFN TI LMZ20502SILT

Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef

Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe

Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.

Pb free BGA and Sn Pb solder paste

Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz

Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

Best Lead Free Solder to use

Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez

Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 09:49:02 EST 2000 | JAX

Although I hate to see anyone leave I cannot help but feel that the forum will benifit from it. Once you no longer look at the forum as simply a medium to carry out your technical discussions and start thinking of it as a way to benifit yourself, the

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 09:49:02 EST 2000 | JAX

Although I hate to see anyone leave I cannot help but feel that the forum will benifit from it. Once you no longer look at the forum as simply a medium to carry out your technical discussions and start thinking of it as a way to benifit yourself, the


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