Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
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Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. There are additional details of alloy and flux performance not covered that can be very important in the selection process. It is always worth a call to your Nordson EFD solder sales specialist to review requirements to ensure you are using the best solder paste for the job. Step 1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
! This will contaminate the unused paste and degrade its performance. Process and Inspection I’m getting solder balls on the sides of my chip components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t
. Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls Nordson DAGE High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=1
. Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls Nordson DAGE High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
? Posted on 5st June, 2012 by Mark Pilkington Well I’ve got to say it again, what is wrong with the existence of voids in solder joints