Industry News | 2017-02-28 20:41:01.0
PDR is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems. The PDR IR-TS One Bench Top System and TS-2100 Cabinet System have been designed to thermally cycle key critical components and assemblies to detect defects. Applications include testing electronic assemblies, electronic devices, bonded structures of plastics and ceramics in a wide variety of fields, including medical, automotive, avionics, space and defense.
Industry News | 2016-02-06 00:54:37.0
Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2016-02-06 00:54:38.0
Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2017-04-23 11:18:17.0
PDR, a leader in IR rework, test and inspection, is pleased to announce that Horizon Sales will discuss its new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 2, 2017 at the Milwaukee Airport Crowne Plaza in WI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S.
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2007-11-08 21:34:39.0
Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
Industry News | 2016-11-02 11:13:40.0
The market leading bond tester Condor Sigma can be equipped with a camera to do motion and strain analysis. It includes a wide variety of visualization options.
Industry News | 2017-05-26 14:54:11.0
Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Industry News | 2021-05-11 14:58:49.0
Z1 Foil Technology improves overall environmental performances and long-term stability
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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