Electronics Forum | Tue Apr 13 22:11:49 EDT 1999 | Dave Kalen
| I am begining to evaluate hi speed chip shooters. We are interested in the Panasonic MV2E. Does anyone have any experience with the turret style placement equipment, Panisonic in particular. | Thanks, | Jeff | Jeff, I think you should also conside
Electronics Forum | Fri Apr 16 00:23:05 EDT 1999 | KEVIN SIMPSON
| | I am begining to evaluate hi speed chip shooters. We are interested in the Panasonic MV2E. Does anyone have any experience with the turret style placement equipment, Panisonic in particular. | | Thanks, | | Jeff | | | | hi jeff, i have about 4
Electronics Forum | Sun Feb 22 02:23:25 EST 1998 | Jon Gruett
Chang, I recommend that you stop by the Siemens booth at the NEPCON West show and see the F4 and F5 machines. I think you will be pleaseantly surprised by what you see. Take some time and really research the next generation of machines that are her
Electronics Forum | Fri Jun 23 11:49:29 EDT 2000 | Big H
Is it just like that "smart" golf ball - where you tell it, "stop!!! stop!!!" ....or "go further!" go further! So this smart solder, you can tell it "don't skip!! don't skew!!"
Electronics Forum | Sun Jan 28 15:34:01 EST 2001 | Kelvin
Dear David, I suppose you may contact Cookson Performance Solution. They offer quite a wide range of service. http://www.cooksonsolutions.com I hope you find it useful. Kelvin
Electronics Forum | Thu Apr 10 07:24:56 EDT 2003 | pjc
I had a similar problem with cracked caps. I checked all my processes and finally found that the caps were cracked in the tape. Check the condition of the caps in the tape. This was unique to one mfg.- EPCOS.
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Fri Apr 11 00:32:17 EDT 2003 | Joe
Hello, Regarding the failures not showing up at ICT. Failed decoupling caps are notoriously difficult to diagnose within ICT. Check with your test engineering folks and ask them how they've coded for these parts. I doubt that they will say those
Electronics Forum | Fri Apr 18 16:53:25 EDT 2003 | takfire
DST, What was the crack signature? Was the crack parallel with the internal electrodes or 45� with the terminal electrode? It is also important to determine the orientation of the failed caps on the PCB (in regards to depaneling). Perhaps the cap
Electronics Forum | Fri Apr 18 19:15:49 EDT 2003 | adlsmt
Please elaborate on "De-paneling method" vs. boards being "snapped out of thier pannel". Read the last post before mine again.
