Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias
SMTnet Express April 25, 2013, Subscribers: 26322, Members: Companies: 13358, Users: 34615 Determination of Copper Foil Surface Roughness from Micro-section Photographs by: Scott Hinaga, Soumya De, Aleksandr Y. Gafarov, Marina Y. Koledintseva
SMTnet Express, November 4, 2021, Subscribers: 26,512, Companies: 11,460, Users: 26,912 Fabrication Of Solderable Intense Pulsed Light Sintered Hybrid Copper For Flexible Conductive Electrodes Additively printed circuits provide
SMTnet Express, February 10, 2022, Subscribers: 25,941, Companies: 11,514, Users: 27,054 MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications Copper clad laminates (CCLs) with low
