SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
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In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
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Condition: New Machine Type: Machine for soldering&removing a chip Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, Personal repair shop, Repair shop, University Laboratory After Warranty Service: Video technical support
Name: BGA Soldering desoldering Machine for motherboards repairing Condition: New Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, mobile phone assembly, Computer production and services, Repair shop, Electronic repair j
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
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