Electronics Forum | Thu Jun 16 17:31:14 EDT 2005 | Doug
Chris, From your email I am assuming you are using an immersion tin process. Is that correct? If so, I would highly recommend you talk to your board house about the amount of tin that is being deposited on your boards. If the tin deposit becomes ver
Electronics Forum | Thu Dec 08 01:05:34 EST 2005 | Mike_Kennedy
Our new PCB supplier can give us a 20% price reduction if we convert from an ENIG finish to a FLASH gold finish. My uderstanding between the two is as follows: ENIG - Nickel is plated over copper and then immersed in Gold which forms a self limited f
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Mon Apr 23 09:18:15 EDT 2001 | Brandon
We are currently investigating getting a small SMT line in-house...very low quantities. I have been looking at Screen Printers and have also stumbled across Solid Solder Deposit Technology at 2 companies. I'm not sure whether we want to have the So
Electronics Forum | Thu Sep 02 12:40:55 EDT 1999 | John Thorup
| Dear Netters, | | Can you kindly suggest what cause solder splash in IR reflow boards ?? What are the main causes normally ?? | | | Best Rgds, | Felix | Felix - we need a better description of what it looks like. If it's a spray, usually balls
Electronics Forum | Wed Apr 10 22:46:04 EDT 2002 | davef
On SMTnet, we've discussed the the frailties of controlling paste height, when volume is a more telling measure. Sometimes if you seperate too quickly, the paste tries to stay attached to the aperture walls. This creates a 'U' shaped deposit with r
Electronics Forum | Thu Oct 31 16:13:46 EST 2002 | babe
If your processing with Nitrogen, tombstoning can be caused by your cooling rate. Go thru the solid/liquid phase of the solder slower..iN other words as you transition into or out of the liquidus pahse if 63/37 alloy 183C, ensure that your Delta are
Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman
Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi
Electronics Forum | Tue Jun 01 05:17:16 EDT 2004 | Alistair MacAdam
I am currently looking at the volume of paste being deposited on a PWB 2.4mm thick with a 0.25mm tolerance. I am looking for information on PWB variation and a MPM AP25 series printer, and can the volume of paste be controlled on varing PWB thickness
