Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000
Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Tue Jul 24 10:29:10 EDT 2007 | ed_faranda
Is there a reason why you want to wash the board before wave?!?!? What is your process flow? I run bottom side of my boards first, then top just to make it easier to setup (easier to put those support pins around those smaller components). But,
Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip
Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa
Electronics Forum | Thu Aug 15 05:39:23 EDT 2002 | surachai
Hi all ; Anyone have the experience with the double side reflow at the same time both top and bottom ? I want to know the description of this process and the possibility of this process ,or could you suggest me the source or contact person of this t
Electronics Forum | Thu Aug 15 09:02:04 EDT 2002 | davef
The fine SMTnet Archives have a couple of threads on double side reflow. Bob Willis Technical, Director, SMART Group, produced a Charity Report on the specific process of Double Sided Reflow Assembly. You can get the report from the SMTA [ http://w
Electronics Forum | Fri Aug 16 06:39:12 EDT 2002 | Matt Kehoe
SIPAD solid solder deposit and glue dots is an excellent solution. www.sipad.com Matt Kehoe SIPAD Systems Inc
Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
