Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
Electronics Forum | Tue Apr 07 14:56:30 EDT 2015 | davef
Try a beer can opener, like thi: http://www.foodservicewarehouse.com/american-metalcraft/cab45/p386302.aspx?utm_medium=cpc&utm_term=American-Metalcraft-CAB45&utm_campaign=Bottle-Openers&utm_source=googlepla&source=googleps&utm_content=googlepla|mkwid
Electronics Forum | Tue Oct 10 16:27:21 EDT 2006 | slthomas
No but the owner of the last company I worked for used to think prying PLCCs off the board with a screwdriver (using an R0805 as a fulcrum and crushing it in the process) was a valid test. "Feels pretty weak...our intermittent failure must be a pro
Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Electronics Forum | Tue Jun 13 17:16:44 EDT 2006 | slthomas
"I believe I was the one who stated in an old post that prying the leads is rediculous." I have been down this road as well. The prez of my previous employer decided that because he could pry .012" leads off the pads with a screwdriver that we had a
Electronics Forum | Mon Mar 18 11:25:24 EDT 2013 | cyber_wolf
I was at an SMTA meeting Friday. One of the topics of discussion was nano coatings. 1. Nobody wants to talk about where the coating goes as it wears off. 2. There are different types of nano coatings : Chemically bonded which involves a special bon
Electronics Forum | Mon Jun 13 07:44:15 EDT 2005 | bandjwet
Peter: Based on our company's experience with removing a variety of different coatings, including parylene, the BGA's can be removed. We would use a chemical etch followed by a neutralizing process. We would then reflow the devices and pry them off
Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Mon May 09 11:29:05 EDT 2016 | jpal
I wanted to bump this up. I am having the same problems. I cannot convince folks it is a solder mask issue and not our process issue, even though it shows up after wave and wash. I can heat the boards and even send them back through the wave preheate
Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd
Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder
