Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Industry News | 2003-07-07 09:27:49.0
Commenced a public offering of 4,500,000 shares of its common stock at a price of $10.00 per share.
Industry News | 2020-02-06 07:13:51.0
Seika Machinery, Inc. announced its sales awards during its annual sales representative training meeting on Tuesday, February 4, 2020 during the IPC APEX EXPO.
Industry News | 2010-08-27 14:01:15.0
Job Shop Company CEO Ben Edwards produced his first contract manufacturing tradeshow in nearby Paramus, N.J., in 1975. Thirty-five years later, the Greater New York Design-2-Part Show proudly supports his vision of sourcing parts and components that are “Made in America.”
New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a
Technical Library | 2012-11-01 20:54:49.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Industry News | 2017-05-18 20:07:59.0
KYZEN plans to exhibit at the Toronto SMTA Expo & Tech Forum held in conjunction with the International Conference on Soldering & Reliability (ICSR). The event is scheduled to take place Wednesday, June 7, 2017 at the Edward Village Markham in Ontario. KYZEN’s team will discuss the KYZEN ANALYST™ Real-Time Concentration Monitoring & Reporting System.
Industry News | 2019-04-23 07:52:35.0
BTU International is pleased to announce that JW Corporation will represent the company in Canada. Owner and President of JW Corp. Jason Wahba recently expanded his territory to cover all of Ontario along with Quebec, New Brunswick, Nova Scotia, Prince Edward Island and Newfoundland, Canada.
