New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2008-06-11 18:26:39.0
FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.
Industry News | 2009-03-18 14:23:09.0
Fine Line Stencil will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2012-09-13 19:50:44.0
Tropical Stencilwill highlight its Laser Cut Stencil and E-formed, Nickel and Stepped Stencils, along with its full line of printed circuit boards in booths #504 and #215 at the upcoming SMTA International Conference and Expo
Industry News | 2012-09-24 16:23:06.0
Tropical Stencil, a leading provider of laser cut stencils, recently has added several new product enhancements, along with full service printed circuit board (PCB) sourcing.
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Industry News | 2008-03-12 15:38:55.0
Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Industry News | 2016-03-10 19:12:32.0
Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Industry News | 2009-04-23 20:18:43.0
Fine Line Stencil has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil.
