Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
Breakthrough in Molecular Design Featured Article Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet Washington State Magazine Cherie Winner PULLMAN,Wash.- Researchers at Washington State University have created design