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LED PCB

Industry News | 2009-03-05 15:30:09.0

Thermal Management for LED Boards

Saturn Electronics Corporation

Economical Aluminum Substrates Make Light Work of Visible LED Circuits

Technical Library | 2009-04-09 17:29:48.0

Advances in solid state light emitting diodes (LEDs) over the last several years have opened new applications for these devices. Traditionally used only in low power, low light output applications, modern high power LEDs are finding their way into a wide variety of applications. LEDs for lighting applications offer several advantages over traditional incandescent lighting methods

IRC, Inc - Advanced Film Division of TT electronics, plc

Developing An Effective, Fast-Curing, Environmentally Sound Conformal Coating

Technical Library | 2010-02-10 23:50:23.0

The electronics industry has recently undertaken the transition to lead-free processing as a direct consequence of the RoHS directive, which came into force in July 2006. However, this is unlikely to be the last transition required since the European Solvent Emissions Directive, 1999 is starting to be implemented and enforced by national governments. This is resulting in pressure on larger manufacturers, currently emitting more than 5 tonnes of solvent vapour per annum to take steps to limit and reduce their emissions.

Chase Electronic Coatings

XRF Technology In The Field - XRF Technology For Non-Scientists

Technical Library | 2022-03-21 19:00:07.0

X-ray fluorescence (XRF): a non-destructive analytical technique used to determine the chemical composition of materials XRF occurs when a fluorescent (or secondary) X-ray is emitted from a sample that is being excited by a primary X-ray source. Because this fluorescence is unique to the elemental composition of the sample, XRF is an excellent technology for qualitative and quantitative analysis of the material composition. XRF spectrometry has a broad range of applications in industry, which we will discuss later in this ebook.

Thermo Fisher Scientific

Exceptional Optoelectronic Properties of Hydrogenated Bilayer Silicene

Technical Library | 2015-03-19 20:33:34.0

Silicon is arguably the best electronic material, but it is not a good optoelectronic material. By employing first-principles calculations and the cluster-expansion approach, we discover that hydrogenated bilayer silicene (BS) shows promising potential as a new kind of optoelectronic material. Most significantly, hydrogenation converts the intrinsic BS, a strongly indirect semiconductor, into a direct-gap semiconductor with a widely tunable band gap. At low hydrogen concentrations, four ground states of single- and double sided hydrogenated BS are characterized by dipole-allowed direct (or quasidirect) band gaps in the desirable range from 1 to 1.5 eV, suitable for solar applications. At high hydrogen concentrations, three well-ordered double-sided hydrogenated BS structures exhibit direct (or quasidirect) band gaps in the color range of red, green, and blue, affording white light-emitting diodes. Our findings open opportunities to search for new silicon-based light-absorption and light-emitting materials for earth-abundant, high efficiency, optoelectronic applications.Originally published by the American Physical Society

Oak Ridge National Laboratory

Automated Optical Inspection Method for Light-Emitting Diode Defect Detection Using Unsupervised Generative Adversarial Neural Network

Technical Library | 2021-11-22 20:44:44.0

Many automated optical inspection (AOI) companies use supervised object detection networks to inspect items, a technique which expends tremendous time and energy to mark defectives. Therefore, we propose an AOI system which uses an unsupervised learning network as the base algorithm to simultaneously generate anomaly alerts and reduce labeling costs. This AOI system works by deploying the GANomaly neural network and the supervised network to the manufacturing system. To improve the ability to distinguish anomaly items from normal items in industry and enhance the overall performance of the manufacturing process, the system uses the structural similarity index (SSIM) as part of the loss function as well as the scoring parameters. Thus, the proposed system will achieve the requirements of smart factories in the future (Industry 4.0).

Shenzhen University

Characterizing of Emissions from Open Burning of Electronic Waste using TG-GC-MS System

Technical Library | 2023-03-27 19:18:38.0

Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.

PerkinElmer Optoelectronics

LED MCPCBs

Industry News | 2009-10-27 15:51:02.0

Metal Core LED Circuit Boards

Saturn Electronics Corporation

PH 100 Low Profile Infrared PCB Preheater

PH 100 Low Profile Infrared PCB Preheater

New Equipment | Rework & Repair Equipment

Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and

PACE Worldwide

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.


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