Electronics Forum | Wed Feb 25 11:47:09 EST 2015 | emeto
What are the chances for redesign the board or use substitute for the current tall part? Sometimes the hassle you want to go through could be avoided. How about change the box the device goes to or modify/ customize it to fit this part better in?
Electronics Forum | Wed Feb 25 12:01:15 EST 2015 | jasonnova
Welcome to the world of Contract Manufacturing. Unfortunately there is not an opportunity for redesign. This is a growing customer that we are training to involve us during the design stage to avoid production issues like this. The customer would
Electronics Forum | Thu Aug 20 02:14:16 EDT 2015 | armandogomez
Hello ! I am looking for a manufacturer for a eccentric screw pump, we have a Bartec equipment but that machine is pricey and we are looking for a low budget for some prototypes we have to do, and they have a epoxy encapsulation. Thanks
Electronics Forum | Mon Oct 12 04:55:54 EDT 2015 | akon63
Hiiiii The X36 Series encapsulates the most advanced development in x-ray imaging technology on the market with a full set of inspection tools, providing outstanding detection sensitivity for contamination detection and product integrity checks. V
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
Electronics Forum | Thu Jun 18 14:25:21 EDT 2020 | sara_pcb
We have observed Plastic BGA crack in encapsulation to substrate interface. After reflow, the device was not functioning. The Crack is observed in the fresh lot during visual inspection. What is the attachment process of package to substrate? where c
Electronics Forum | Tue Mar 09 18:04:34 EST 2004 | davef
Obviously, if your customer instructs you to use a certain flux type, using THAT flux type is probably a good idea. Responding to your question: Chloride is one of the more detrimental materials found on printed circuit assemblies. Chlorides can com
Electronics Forum | Tue Jun 06 20:13:31 EDT 2000 | Dave F
Not as easy as that Bob. But this may help you get started ... IC packaging materials include: � Silicone - Room temperature vulcanized silicone - Heat curable hydrosilation silicone � Biphenol & multifunctional epoxy glob tops � Polyurethane � Pol
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment
Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away
