Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Wed Jan 03 10:41:47 EST 2007 | Rob
Consider this: The inner balls will be at a lower temperture than the outer balls in reflow, so if you cannot inpsect them then that may be where your problem lies. Are you reworking with a specialist machine that is directing the right amount of h
Electronics Forum | Tue Dec 06 15:27:36 EST 2005 | Mike
Steve, You are correct in that X-Ray image of a BGA will not show flux residue. So what? If you are using no clean flux then I would think it doesn't matter if there is some flux residue. Sure if you are reworking a BGA and the operator dumps t
Electronics Forum | Tue Oct 10 04:10:43 EDT 2000 | Tanu
Hi, Jacko is right!BGA ispection equipment like Xrays are extream expensive if you want a good system. There is some xrays that you can have low cost but if you are planning to do superBGA�s or want better image you need atleast 80-100Kv with good r
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
