Electronics Forum: extra components (Page 5 of 25)

Re: wave solder bridges

Electronics Forum | Thu Jul 27 13:59:04 EDT 2000 | Chrys Shea

Sounds like the problem is design realted - here's a cheesy trick if your product/process permits: (you know how I love my cheesey tricks!) Put an adhesive dot between the pins that are bridging. If you're gluing bottomside SMT components to the bo

Non RoHs Requirement

Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell

If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d

MY 19 Issues?

Electronics Forum | Mon Dec 07 09:43:09 EST 2009 | kpm135

Just to throw my two cents in the MY19 could be slower than the other my machines due to the greater distance the head has to travel to pick up and place the components.The longer distance could also account for extra wear and tear on the motors and

Type 4 solder paste

Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto

Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

Temperature Profiling

Electronics Forum | Thu Dec 10 16:57:32 EST 2009 | vetteboy86

I'm just getting into temperature profiling our PCB's. We recently bought a new reflow oven. The company purchased a mole before I was hired. This is what I will be using. What is the preferred way to attach the thermocouples to the PCB locations of

SMT COMPONENTS

Electronics Forum | Tue Jul 16 07:33:32 EDT 2002 | pjc

Communication is the issue. What we have here is a failure to communicate....how does that song go? I implemented a system whereby incoming inspection would check component packaging to the spec. If it did not match they were to contact the process e

through hole questions

Electronics Forum | Wed Nov 19 19:06:42 EST 2014 | spoiltforchoice

Plenty of people don't like cut 'n clinch and might appreciate just having the cut part. We do a mix of OEM and CEM work, because of the low volumes special tooling for a product is often out of the question so that is one thing to consider. We use t

Quoting a job for manufacturing

Electronics Forum | Fri Nov 09 20:33:28 EST 2001 | caldon

There is two directions I see here...1) you are looking for a bid comaprison or 2) you are going to build boards with the machines you cause they are not being used in full capasity. Some OEMs and/or CEMs charge extra for "cut tape" (Not full reel)c

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Tue May 25 20:29:41 EDT 2004 | Grant

Hi, That's the interesting point, and I think it's got to do with the design of the placement. You have 8 pick heads in the Hydra head, and they all line up with a tape in the feeder. So in theory when it can pick all 8 components at once, and the


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