Electronics Forum | Wed Feb 19 17:27:14 EST 2003 | ryanm
I have a problem with 0805 caps and resistors randomly falling off in the wave solder machine. Currently I am placing single dots of epoxy under 0805's. The single dot is flattened down so I know that the part was placed. In the past when we double
Electronics Forum | Sat Feb 22 11:27:16 EST 2003 | stefwitt
In the early days of SMT we were using vibratory bulk feeders for chip components. It was quite obvious that some of the components had to try several times getting through the gravity trap or with the right side up through the light sensor. As a res
Electronics Forum | Wed Mar 26 22:17:09 EST 2003 | dlkearns1
I Like your analysis here. I dunno the whole story, but I've tracked parts popping/falling off to the metalazation of the parts, from various suppliers, as most suppliers have some type of pre-tinned coating on the leads.(not that this means anything
Electronics Forum | Sat Mar 15 09:55:33 EDT 2008 | ppcbs
As a rework house to contract manufacturers, a majority of the BGA rework we receive is failing due to Black Pad issues. Recently we have been taking in a lot of consumer products that have parts just falling off the lead free boards that are assemb
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak
We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin
Electronics Forum | Mon Mar 12 13:51:08 EDT 2018 | cyber_wolf
It is BS. Solder is either liquid or it isn't. Getting it hotter doesn't make it more liquid. Its very easy to prove them wrong. Have them create a profile with the bottom heater turned down. Run boards and see how many parts fall off. You create
Electronics Forum | Tue Jun 06 17:20:05 EDT 2000 | Travis Slaughter
There is no difference in 0402�s on the bottom side than 0603 0805 1206. They will not fall off or tombstone, unless they where before you put them in the oven.
Electronics Forum | Wed May 03 17:40:06 EDT 2000 | Steve B.
Does any one you High temp past for bottom side surface mount components instead of using adhesive. We are having components falling off be for we wave, the problem is that we need do a lot of thru-hole assembly before waving. Thanks for your help.
