Electronics Forum | Mon Sep 20 22:17:04 EDT 2021 | ttheis
SOLVED Upon manually activating the zaxis to drive the spindles down, it was noted that the touch down sensor for spindle #2 was activating at a certain point in the travel without touching anything. I went to look at the adjustment of the sensor
Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon
Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Fri Apr 20 07:54:25 EDT 2007 | Bob R.
I'm in the high reliability (exempt) sector and have thermal cycled hundreds of boards in the past few years. As far as which is more reliable, SnPb or SAC305, my data is similar to what the technical literature is saying, "It Depends". In low stra
Electronics Forum | Fri Aug 04 15:45:27 EDT 2000 | John Thorup
Ditto to everything said. If everything in the process is correct you will have good success at 25 mil but it will take much care. I have done 20 mil on this type of printer but, as Steve says, I wouldn't want to on a daily basis. Those wipe-offs a
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Electronics Forum | Thu Dec 30 21:22:12 EST 1999 | Jim
Mike, Thanks for the reply. It's not really a matter of slope. It is the long term thermomechanical fatigue that the solder joint undergoes as a result of repeated severe temperature swings, while the product is in use. Non-leaded parts are suscep
Electronics Forum | Fri Dec 10 17:08:51 EST 1999 | John Thorup
Tell those leads not to be drinking so much. Anyway... too bent to work in a sequencer or auto insertion machine is a lot less bent than if you're trying to manually stick it into a hole. As far as where the lead exit/enters the body of the compone
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
Electronics Forum | Tue Aug 14 21:43:44 EDT 2001 | mugen
Basic understanding, 1) the 2% silver (Ag) gives better shine *joint surface*. 2) Ag improves stength & fatigue resistance of solder joints 3) reduces leech-out of silver from silver-base substrates (eg of such silver-base surface contact: metalli
