Electronics Forum | Tue Jul 27 06:08:18 EDT 2004 | C Lampron
Good Morning Everyone, Could someone please tell me what the acceptable range is for HASL plating thickness. We have some raw boards with plating thicknesses ranging from 3-4 mils on a fine pitch QFP. We are expeiencing bridging at this location an
Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Tue Jun 08 08:38:15 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Tue May 16 14:17:34 EDT 2006 | russ
If the terms are connected electrically it does meet IPC bridging between "non common conductors" is the defect you should be fine, FYI, the .010" spacing is a violation of IPC 782 Russ
Electronics Forum | Mon Dec 17 15:11:35 EST 2007 | chef
Blew chunks - thanx for thinking outside the box. Of course there's two sides to every story. Just last week I had a new operator "splash" a couple of boards. Top solder was great, it was all one big solder bridge. Come to find out, the operator forg
Electronics Forum | Sat Oct 30 12:17:25 EDT 2004 | dorklover664
From an operators stand point there really is no difference. I think what I work with now is a 7 zone and I have worked with 8 and 5 zone BTU ovens. The only difference I can really tell is on the 8 zone oven we had less bridging at the end. If you r
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Thu Sep 02 08:57:29 EDT 1999 | Scott
I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a n
Electronics Forum | Tue Oct 15 08:27:31 EDT 2002 | davef
I can't comment on 20 pitch TSOP, but wave soldering wider pitch parts require: * Orienting components with the leads perpendicular to the wave [moving parallel to the rails]. * Thieving [robbing] pads on trailing pads for the component. Search the
Electronics Forum | Sun Aug 06 19:05:38 EDT 2017 | zsoden
OK thanks. I had assumed that since the soldering was generally smooth and we were having no issues with bridges that the flux would be operating fine. But there really isn't much left to check so I'll get my profiler fixed (the thermocouple has been
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