Electronics Forum | Mon Oct 02 16:31:17 EDT 2000 | Larry
I have seen people take old stencils and cut out land patterns, place the component over the land pattern and use a orange stick to move the leads back into place.
Electronics Forum | Thu Sep 07 10:39:34 EDT 2006 | vicknesh28
Can u elaborate on the bad plating? Have u had any experience on this before? The component has 90/10 Tin lead plating
Electronics Forum | Thu Sep 07 03:47:07 EDT 2006 | vicknesh28
I have been getting non wets on fine pitch QFP packages on random leads during reflow process. I noticed that every time there is some flux residue left between the non-wet lead and the solder pad. No residue was not observed on the rest of the good
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Wed Nov 06 16:31:59 EST 2002 | slthomas
I would also consider paste control (don't take it personally...I always have to get after people about this one), time on the stencil, time between print and reflow, solderability of the component leads, paste volume (that one really got us once....
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Wed May 17 14:02:06 EDT 2006 | russ
So, what is the pitch of the part and the pad size, also tell us the thickness of stencil. Russ
Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123
I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe
Electronics Forum | Sat Jun 18 00:35:15 EDT 2005 | mskler
Thanks to all. I am working on your suggetions will get back as the problem solved
Electronics Forum | Thu May 18 12:00:42 EDT 2006 | jdengler
I think he edited his original post.
