We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
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Quick Turn Prototype to Med. Vol. SMT assembly, including Fine Pitch, and BGA. Onsite Engineering.
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Our Ultrasonic Stencil cleaners and 440-R-SMT Detergent are US & CA EPA Certified cleaners, that are environmentally and user safe. We are your single source for cleaning any type of solder paste from any fine pitch stencil.
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The automation company that produce QFP/BGA mounter with competitive price in Taiwan.
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Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
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EMS Provider of consignment and full turnkey PWA Assemblies, Cable Assemblies, Wire Harness, Box Build, and Test Services. Services include conformal coat and xray. AS9100, ISO9001, ITAR, IPC610, JST-001.
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Leading supplier of highly engineered products and solutions, components and subsystems to top manufacturers, major government contractors, international government and military organizations.
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Elscott specializes in low to medium volume PCB assembly. We manufacture to military specifications and can be RoHS compliant. We have 0201 chip capabilities and do quick turn prototyping.
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Fully automated assembly, advanced product introduction processes. ISO quality system compliance, high standards for medical, military, and other discerning markets. Quick turn prototyping, lower cost per engagement inc. low volume prod.
Industry Directory | Manufacturer
Quick turn small and large lots of boards. Turnkey service also available. Fine pitch placement optical Philips Topaz.