Electronics Forum: glue profile (Page 5 of 13)

Losing parts in reflow

Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0

we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick

archives

Electronics Forum | Thu Mar 08 22:06:52 EST 2001 | davef

Two things 1 Your glue supplier is the best source of advice on cure profiles. 2 Try ... adhesive and cure ... you should get 3 threads

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 20:19:12 EST 2007 | davef

Q1: How many mils the gap between the terminal and pad? A1: It depends on properties of the glue and z-force when the component is placed by the assembler. Q2: Your practice is for technology SMT-4? A2: We don't understand SMT4. We know that very sm

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F

| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon

| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t

Losing parts in wave

Electronics Forum | Tue Oct 05 18:07:53 EDT 1999 | Bill Haynes

I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Our pa

Does anyone remember the takt time formula for the reflow oven

Electronics Forum | Mon Mar 31 07:58:50 EDT 2008 | vinitverma

Assuming the following: L=Process Length of the oven t=Desired profile time in mins(depends on the paste/glue used) l=PCB length l1=gap between consecutive PCBs Then the total no. of PCBs per hour is" (L*60/t)/(l+l1) Vinit

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell

| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus

Reflow soldering of 208-RQFP-0.5mm

Electronics Forum | Mon Oct 31 09:52:23 EST 2005 | slthomas

The only problems I've ever had with 208's shifting out of alignment was with a board with too much HASL thickness. The lands had a convex profile and the parts kept slipping downslope. We put down a glue dot and ranted at our board supplier. Both

Super M.O.L.E or Slim KIC 2000 for oven profiling?

Electronics Forum | Wed Jul 31 10:03:44 EDT 2002 | gdstanton

Todd, Slim KIC 2000 would be my choice. We traded our Gold M.O.L.E for it and are very happy with the performance. The optimization program is great. No more guessing. The only thing I could gripe about is that it sucks up 9V batteries pretty quic


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