| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Added moisture sensitive and process sensitive component usage – 3.8 Changed gold removal process - 4.5.1 Added heat shrinkable soldering devices - 4.19
| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_21_09.pdf
Added moisture sensitive and process sensitive component usage Changed gold removal process Added heat shrinkable soldering devices
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. For example a separate mech layer for: milling, via-fills, gold plating, V-scoring, cutouts or whatever additional process have to be performed on the board
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
. For example a separate mech layer for: milling, via-fills, gold plating, V-scoring, cutouts or whatever additional process have to be performed on the board
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. For example a separate mech layer for: milling, via-fills, gold plating, V-scoring, cutouts or whatever additional process have to be performed on the board
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
