Electronics Forum | Wed Jun 02 05:37:08 EDT 2004 | johnwnz
dave, let me just go on record as saying your a scary individual if you knew all that off the top of your head! John
Electronics Forum | Sat Nov 01 11:08:47 EDT 2008 | vladig
In addition to what Dave has said, you shouldn't worry much about having too much (too thick) of Au, as it's a self-limiting process. So Gold embrittlement isn't an issue. Regards, Vlad
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Tue May 21 16:18:57 EDT 2019 | edhare
Interesting problem. I've seen this before on SMT device leads (see Gold Embrittlement paper at http://www.semlab.com). The AuSn4 IMC is solid at typical reflow temperatures and traps volatiles in the solder joint. One usually cannot crank the ref
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Tue Jun 01 13:38:18 EDT 2004 | cyber_wolf
To maybe simplify, contact David Sbiroli(Apps. Engineer) @ Indium corporation. I have worked with Dave on this issue before. He can most likely get you the info you need. 1-800-4 INDIUM PS: Dave F. : My plasma arc accumulator has unusual carbon sco
Electronics Forum | Wed Jun 02 12:42:00 EDT 2004 | cyber_wolf
It has been our experience that Spallation Neutron Source units are definitely a problematic area. But...we have just recently found that if you tweak the trim characteristics on the hydrogen assimilation unit, ion pacification can truly be achieved
Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr
I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
