Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris
what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help
Electronics Forum | Tue Jul 18 22:11:13 EDT 2006 | davef
Aping Russ' reply: * ~70% of the time solder on gold fingers is caused by poor printing and handling processes. * ~25% of the time solder on gold fingers is caused by poor thermal recipe when soldering. * ~5% of the time solder on gold fingers is cau
Electronics Forum | Tue Jun 13 08:17:06 EDT 2006 | davef
The solder alloy does not change based on the flux. Your potential for embrittlement is the same [providing the metal of the solders are the same] with either solder. We would guess the OA flux is [and drag tinning are] removing corrosion from the
Electronics Forum | Mon May 06 12:20:09 EDT 2013 | davef
Gold in solder alloys can be brittle. We always used to talk about keeping gold LT 3% in order to avoid embrittlement. Some military contracts require removal of gold from soldered contacts. Adding gold to a solder alloy that you're familiar with wi
Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
Electronics Forum | Tue Sep 30 14:16:49 EDT 2003 | davef
While your waiting for others to respond, search to fine SMTnet Archives on: "solder and gold and finger"
Electronics Forum | Mon Sep 29 23:46:51 EDT 2003 | daman
Hello everybody, We have a new product having a lot of open gold area. solder splashes during the reflow is a pain in the... Its an extremely small PCB and kapton taping is not an option. Stencil is at 10% reduction, Cleaning after every cycle. Reflo
Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
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