Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Wed Jul 26 18:23:47 EDT 2000 | Gary
I have been following forum discussions here and eslewhere, attended technical sessions at APEX and have been experimenting with the paste-in-hole process on some of our new product. I have run into one problem I have never seen mentioned, that is a
Electronics Forum | Mon May 15 13:55:00 EDT 2000 | Aldo
We are in the process of researching manual or low cost automatic Tape and Reel equipment. I have heard about V-tek and Systemation. I would appreciate if someone can tell me any problems or virtues of theses two brands that have been experienced. Al
Electronics Forum | Fri Mar 24 15:20:27 EST 2000 | Chris McDonald
I have recently purchased a Tape and reel machine from V-Tech. We are using Presure Sensitive tape and we are not geting good results. Anything bigger that a SOIC14/16 gives us trouble. The cover tape will pull off on the feeder and we will lose part
Electronics Forum | Mon Mar 06 17:17:13 EST 2000 | gary
I need a little help with RF and Rogers 4003 board material. My background was in digital and now I need to set up a new line to make small RF products (.5" x .5" or smaller). I want to find out about board platings, finishes/maskings and reasonable
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Fri Jul 15 10:56:19 EDT 2005 | pr
As Russ said, you do a DOE beforehand. BUT Maybe we are missing something, we do SPC after the wave (1/5) to catch defect trends and fix them with a minimum of inspection. If you are running a 2,000 piece pull, are you that confident that your origin
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Tue Sep 13 10:00:27 EDT 2016 | awhite
Switched out the mech. relay on the board loader, no change. Same behavior. Could not find a mech. relay on the printer... SMEMA wiring appears go directly to a PCB. And it is at that point that I run out of talent. If the machine weren't dedicate
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