Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Fri May 21 15:45:29 EDT 2010 | pforister
iv40, Thanks. The PCB that we are populating the BGA hybrid onto does not have holes in the vias. I think the manufacturer indicated that on their hybrid it has holes in pads. This hybrid is a PCB assembly with BGAs and other components populated
Electronics Forum | Thu Dec 04 01:38:04 EST 2008 | lococost
Although super guru Bob Willis said the lead check swabs are not relyable, we have had good results with them. We allways make sure to include 1 confirmed leaded sample to check if the chemical reaction takes place. But we only use them occasionall
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Tue Oct 04 03:16:14 EDT 2005 | grantp
Hi, I thought it was extreemly bad to use lead based parts with lead free solder? Regards, Grant
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
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