Industry News | 2022-10-06 17:57:45.0
Seika Machinery, Inc. is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. Seika will highlight the following equipment in Booth #1012: Malcom PCU-285 Viscometer, McDry Storage Cabinets, Sayaka CT23NJ PCB Router, Malcom RCX Series Modular Reflow Oven Profiling System and Unitech UC-250M-CV PCB Cleaner.
Industry News | 2023-03-06 17:22:53.0
ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society's (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
Industry News | 2023-11-13 12:14:35.0
Seika Machinery, Inc. is pleased to announce the introduction of two cutting-edge products, the Malcom Unitech UC-250M-CV PCB cleaner and the Sayaka CT34XJ router. These innovations bring unprecedented efficiency and precision to electronics assembly.
Industry News | 2009-03-25 22:49:39.0
RANCHO CUCAMONGA, CA � March 2009 � Specifically cited in MIL-2000A, the Zero-Ion ionic contamination tester is one of the industry's most popular Resistivity of Solvent Extract (ROSE) testers. IPC-001 and IPC TM650 recognize ROSE testing as an approved method of determining the cleanliness of circuit assemblies.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2021-05-31 22:07:18.0
Medium Voltage is commonly used for distribution systems with voltages above 1kV and generally applied up to and including 52kV. FOr technical and economic reasons, the service voltage of medium voltage distribution networks rarely exceeds 35kV.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
