New SMT Equipment: laminer (Page 5 of 23)

Multilayer PCB's

New Equipment |  

Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.

Data Circuit Systems, Inc

Integrity Technology Corporation

Integrity Technology Corporation

New Equipment |  

manufacture ceramic resonators; transformers for modem, telephone coupling, HDSL, pulse, switch mode, CCFL Fluorescent converter; Laminate & Ferrite transformer, inductor & coil; turn key circuit board assembly.

Integrity Technology Corporation

Integrity Technology Corporation

New Equipment |  

manufacture ceramic resonators; transformers for modem, telephone coupling, HDSL, pulse, switch mode, CCFL Fluorescent converter; Laminate & Ferrite transformer, inductor & coil; turn key circuit board assembly.

Integrity Technology Corporation

Multilayer Mixed Dielectric PCB

Multilayer Mixed Dielectric PCB

New Equipment | Components

Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry.  Multilayer Mixed Dielectric PCB Specifications:

Standard Printed Circuits, Inc.

ESD Anti-Static Phenolic Bakelite Sheet

ESD Anti-Static Phenolic Bakelite Sheet

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Backed by rich industry experiences, we are leading Exporter, Manufacturer & Supplier of ESD Anti-Static Phenolic Bakelite Sheet in Shenzhen, Guangdong, China. Phenolics are a uniformly dense and structurally strong material that will not soften appr

http://www.energetic-industry.com

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

New Equipment | Materials

Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature

Isola Group

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Copper Foils

Copper Foils

New Equipment |  

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and

Oak Mitsui Inc.

25kg,50kg PP Woven Sack for cement,rice,flour

25kg,50kg PP Woven Sack for cement,rice,flour

New Equipment | Printing

Our plastic woven sack are widely used for: Grains like rice and corn Food like flour and sugar Chemical products like fertilizer Building materials like cement and sand Disposable garbage for shipping daily rubbish and construction waste Squar

ANHUI JINXIANG PLASTIC WOVEN PACKGING ENTERPRISE CO.,LTD


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