Full Site - : leaching at h solder (Page 5 of 27)

Scienscope to Display X-SPECTION 6000 at SMT/Hybrid/Packaging

Industry News | 2016-03-30 08:56:32.0

Scienscope International announces they will exhibit in booth # 7-109 (smartTec GmbH) at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. On display in the booth will be the X-SPECTION 6000 Cabinet X-Ray Inspection System-the ultimate in flexibility.

SCIENSCOPE International

Essemtec Presents Innovations at SMT Nuremberg 2012

Industry News | 2012-04-13 14:02:40.0

In booth 7.203 at the upcoming SMT/Hybrid/Packaging 2012 exhibition in Nuremberg, Essemtec will present several innovations, including Scorpion, the highly flexible dispensing system, as well as two new printers for low-/mid-volume sizes.

ESSEMTEC AG

Finetech to Exhibit at NEPCON China 2011

Industry News | 2011-04-20 16:31:45.0

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Finetech

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

SHENMAO Features Laser Soldering Paste at IPC APEX 2016

Industry News | 2016-02-25 14:29:00.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

See the Revolutionary Solderability Tester from Microtronic at productronica

Industry News | 2013-11-04 14:13:34.0

Microtronic GmbH announces that it will showcase its LBT-210 Solderability Tester in the LICO Stand #481, Hall A4 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Microtronic GmbH

Cobar Solder Products to Introduce SELective Soldering Package at SMTAI 2011

Industry News | 2011-09-21 14:29:15.0

Cobar Solder Products will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition

Cobar Solder Products Inc.

SEHO Systems’ Christian Ott to Hold Presentation at SMTAI 2009

Industry News | 2009-09-17 16:38:58.0

KREUZWERTHEIM, GERMANY ? September 2009 ? SEHO Systems GmbH, a leading worldwide soldering provider, announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT5, titled “Process and Design Optimization for Selective Soldering,” which is scheduled to take place Wednesday, October 7, 2009 from 10-11:30 a.m.

SEHO Systems GmbH

Balver Zinn/Cobar Group to Exhibit SELective Soldering Package at SMTA Penang Tabletop Exhibition

Industry News | 2011-09-28 19:05:28.0

The Balver Zinn/Cobar Group will feature a complete SELective soldering package at the upcoming SMTA Penang Tabletop Exhibition.

Cobar Solder Products Inc.

SEHO Provides the Right Selective Soldering Solution at NEPCON China

Industry News | 2015-03-16 18:02:52.0

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will showcase the new SEHO SelectLine and LeanSelect selective soldering systems in stand A-1A59 in the German Pavilion at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center.

SEHO Systems GmbH


leaching at h solder searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

High Resolution Fast Speed Industrial Cameras.
Fully Automatic BGA Rework Station

"Heller Korea"