Electronics Forum: lead pull (Page 5 of 20)

Solder Joint Strength on Fine Pitch

Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef

Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I

PCB & Ceramic Cap strain - Specification?

Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef

There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She

Leadfree assembly

Electronics Forum | Mon Apr 23 09:37:20 EDT 2007 | davepick

Assuming you are going to build using a Leaded part on a Lead Free Process - beware of Weak Joints. I saw this at a large Multinational company - They had secondary reflow on a Top Side QFP when the PCB went over the wave. We did pull strength tests

Hybrid Profile

Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir

Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind

IPC-A-610 interpretation of wetting angle (Chapter5)

Electronics Forum | Thu Oct 12 22:36:40 EDT 2017 | stefan110882

Please ost some pictures so we can see what > you're talking about. OK here an example. I'm sorry for the bad quality - The picture is cropped and only one of two pictures that I had on the phone that I could use. According to my supervisor, th

Push&Pull Test of Fine Pitch Components

Electronics Forum | Fri Sep 19 14:11:39 EDT 2003 | Bryan Sheh

Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

Leaded and Lead-Free Wave Parameters

Electronics Forum | Wed May 21 14:57:55 EDT 2008 | slthomas

"Good morning gentlemen" Oh my. I may have to pull up a chair with some popcorn for this one.

Re: Surface Mount Connector Strength

Electronics Forum | Fri Jan 15 11:40:37 EST 1999 | Bob Willis

| | I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some c


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