Electronics Forum: missing components in placement (Page 5 of 15)

Components randomly wiped out in reflow

Electronics Forum | Tue Mar 27 01:52:23 EDT 2018 | buckcho

Hello Diego, are the components missing on the first side or the second side. Like Mr. Evtimov said, you can check before the oven the pcbs's visually and see what happens after the oven. In this way you can see if it is the oven for sure. Then there

Components randomly wiped out in reflow

Electronics Forum | Fri Mar 23 03:18:08 EDT 2018 | bukas

hello Diego, I would start by opening oven and looking for missing components. once you locate them you can work from there. are you using any alu caps on your board? I had problem with bad alu caps exploding in oven and scattering other components.

Placement of chips 0201 in Hanwha SM482

Electronics Forum | Fri Jun 12 18:21:52 EDT 2020 | proceng1

I've had components move in the pocket and cause mis-picks. Generally, the part moves, but settles in the pocket after a moment. So I slowed down the pick up speed. It gave the part in the feeder a chance to settle before picking.

Placement of chips 0201 in Hanwha SM482

Electronics Forum | Thu Mar 05 12:58:01 EST 2020 | joeljacobo

Hi everyone, I hope you can help me with this matter. We have a Hanwha SM482 machine and a series of projects involving many 0201 components (resistors, capacitors, inductors, etc.) will be carried out. Making the prototypes I noticed that there is

Re: Through holes in SMT pads

Electronics Forum | Tue Jul 06 16:44:14 EDT 1999 | John Thorup

| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th

Re: Double sided reflow in one pass?

Electronics Forum | Wed Aug 18 08:38:46 EDT 1999 | Jason Gregory

| Is there process by which one can do a double sided reflow (SMT on both sides) in one pass through the oven? | Paul, Here's a way it might be done. Screen your bottom side with paste (if only passives, 0603-1206 & sot 23's), dispense glue for sam

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Sat Sep 11 15:09:46 EDT 1999 | DGrenier

4 Mil Pcb's/yr) My choice was not to go to one vendor for a solution but, to pick (In my Opinion) the best equip to each of the jobs in a SMT line. Hence I have multi-vendor High Volume lines. Back to the ? Budget constraints and cost per placement

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

Re: Microcracking in SMT Pick&Place process

Electronics Forum | Tue Jun 16 09:15:56 EDT 1998 | Justin Medernach

| We are very concerned about microcracking in SMT P&P process. I want to know something about: | What is microcracking? | When did it occur? What are the causes? | How can avuid this phenomena? Toni, Micro cracks can be caused by a ton of conditions

Re: Microcracking in SMT Pick&Place process

Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich

The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the


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