Electronics Forum | Mon Aug 02 11:47:35 EDT 1999 | Mike Lare
Just wanted to thank everyone for your inputs. This info will at least give me a decent starting point.
Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Jul 30 15:22:52 EDT 1999 | M.L
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Thu Jul 14 19:12:40 EDT 2005 | sync40
Hi. In the past years I had made dozens of PCBs but now I am trying to get a professional finishing on them. The main problem is oxidation of the copper traces. Basically I use the silkscreen method to make the pattern in both layers and then etch. L
Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC
I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur
Electronics Forum | Thu Dec 10 04:19:55 EST 2009 | cunningham
do you not have a problem with flux seperating from when it was chilled? due to our high mix low volume we really cant afford to have solder paste waiting for an hour or so till its ready before we can build
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
