Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Wed Feb 04 09:18:57 EST 2009 | stepheniii
You need to profile to the paste. And if a part can't take the temperatures, then you have to have something done about the parts. At one time most components had peak temperature information back when we didn't really need it becuase profiles were
Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan
thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod
Electronics Forum | Mon Jul 19 21:25:28 EDT 2004 | davef
It seems like the flux is burning-up before the metal begins to flow on this slightly odd component. Alpha talks about alternate reflow recipes for WS609, as follows: * A straight ramp up profile is preferred for reflowing low to medium thermal mass
Electronics Forum | Thu Jun 02 11:01:28 EDT 2005 | davef
Xilinx recommended reflow ||Sn-Pb Eutetic||Sn-Pb Eutetic ||Pb-Free||Pb-Free Profile Feature||Large Body||Small Body||Large Body||Small Body Average ramp-up rate (TL-TP), *C/seconds max||3||3||3||3 Preheat - Temperature Min (Tsmin), *C||100||100||150|
Electronics Forum | Thu Jun 01 07:50:16 EDT 2006 | samir
Another nuisance with the new SlimKIC - even for Sn-Pb paste we run a little hotter peak temperatures - you can't run another one in succession because the "internal" temperature is too high as well. Typically, I have to put the unit underneath a fa
Electronics Forum | Thu Apr 26 08:29:37 EDT 2007 | pavel_murtishev
Good afternoon, We develop reflow profile ones and control it daily or when recipe changes after that. Modern reflow ovens are usually very stable. This means that your zone temperature set points won�t deviate from initial ones. You can calculate d
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers
I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.
