Used SMT Equipment | Soldering - Selective
Good running system. Verified! Contact for full details and video of machine in action Pillarhouse Jade S-200 Selective Solder Vintage: 2007 Nitrogen Capable Currently set up for lead free application Solder Wire Feeder with Solder bath level sen
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Standoffs Pillars Brass BRASS STANDOFFS Metric Brass Standoffs Nickel plated threaded stand offs Brass stand off pillars UNC UNEF MEtric ISO threaded 2.5mm 3mm 3.5mm 4mm 5mm 6mm 1/8" 3/16" 1/4" 6-32, 4-40, 8-32, 10-16
Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.
Industry Directory | Manufacturer
Pillarhouse is a leading supplier of selective soldering systems for single-point and multi-point soldering configured for manual loading, in-line or as multiple unit in-line systems offering topside and in-line preheat.
New Equipment | Selective Soldering
Pillar Orissa Synchrodex single Point, in line, Soldering Machine, Nitrogen generation system and vacuum packing Max.size18 x24” (257mmx610mm) min 4”x4” Dual flux assembly Top side IR pre heat with Closed loop pyrometer setting laser Windows ba
Used SMT Equipment | Soldering - Selective
Pillarhouse JADE MKII Selective Soldering Machine Vintage: 2010 Model: JADE MKII Lead-Free Drop-Jet Flux System Auto Solder Top-Up & Solder Level Detect Two AP Style Solder Nozzle Tips Internal Fume Extraction Colour Programming Camera Therm
Industry Directory | Manufacturer
Dedicated to the design and manufacture of fixtures to improve speed and quality in the assembly of printed circuit boards. Providing solutions that challenge the industry's accepted "rules of thumb" for more than 25 years.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Used SMT Equipment | Screen Printers
DEK Horizon 03i Stencil Printer Maximum Board size 20" x 20" (508mm x 508mm) Standard 29"x 29" Stencil Capability Maximum Cycle Time: 14 seconds 1.3 Cpk @ 25 micron (process included) Windows XP operating system DEK Instinctiv TM soft
