Electronics Forum | Sat Mar 29 13:35:32 EST 2003 | MA/NY DDave
Hi Back later on this tread, yet I did want to slightly correct one thing DaveyF wrote. Again only slightly. Even at 90C, moisture does start to leave the board. Now it doesn't do it so well as above 100C at sea level atmospheric pressure, yet it s
Electronics Forum | Wed Apr 09 09:48:49 EDT 2003 | iman
after oven bake dry the PCB, we process within 4-hrs, else need to rebake again under same baking parameter. taking a look, the exact pads with the blowholes are full ENIG pads with no via holes under the solder-intend land areas. In event there is
Electronics Forum | Thu May 22 08:46:05 EDT 2003 | Henry Lee
Hi I uploaded the photos http://hk.photos.yahoo.com/ee02lyk of the failure samples. The chip-cut and pin-hole were found after the manufacturing process. I initially suspect the crack happened during the reflow process.However, our factory analysis d
Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
Electronics Forum | Sat Feb 12 09:24:29 EST 2005 | primus
We don't have any automated machines (UIC) that insert anything into holes larger than our terminals, so about 0.050" is as big a hole we ever have to use before we've plugged them with something. Since we also do a fair amount of Man-U-Sert (yes, yo
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Wed Apr 04 14:29:16 EDT 2007 | rgduval
Anyone have experience wave soldering rigid flex assemblies? I've just picked up a new job from a customer; it's a rebuild for the company, but new to me. The customer had previously taken their business elsewhere due to delamination problems with
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms
Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
