Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM
Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Mon Apr 12 16:25:07 EDT 2004 | pjc
east coast pre-owned supplier: http://www.bidservice.com/ LR Environmental is a west coast pre-owned supplier
Electronics Forum | Fri Oct 01 09:47:36 EDT 2010 | noid
Yes, they should be baked prior. We pre-bake all polyimide fabs, flex or not. They are prone to delam.
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Wed Feb 22 09:48:24 EST 2006 | slaine
Hi Ive checked into this a bit more, there are two coatings im told you can get one is a teflon coating that you paint on then bake, the other is a red oxide (lead free) paint. Also if your using solder pots and they are close grain cast iron they a
Electronics Forum | Sat Jan 08 08:50:35 EST 2005 | davef
Normally, you should not have to bake boards that are properly packaged and stored. Since you are seeing problems, baking makes sense. Consider 125C for 4 to 6 hours. Additionally, look here for more, while waiting for others: http://www.smtnet.
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Fri Nov 26 03:29:00 EST 1999 | TIM GOODMAN
HI WELL WE HAVE PLACED BGA,S AT A COMPANY ON A TRIAL BASIS, THE ONLY PROBLEM IS THAT YOU USE A PART DATA WITH A SQUARE PART IE PART TYPE 2 WITH A VERY SMALL BODY TOL .THIS WORKS WELL ON LARGE BGA,S BUT PLEASE PRE ROTATE AND MOVE AS SLOW AS POSSIBLE.
Electronics Forum | Mon Dec 28 14:57:07 EST 1998 | Earl Moon
| Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience. | Much depends on your environmental controls and those of your suppliers. PB
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