Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Mon Mar 03 08:16:00 EST 2003 | martys
We are using MPM and DEK printers, what are the critical variables for measuring print process capability?
Electronics Forum | Fri Jul 06 18:48:28 EDT 2012 | saju86ece
Hi, I have one query about cleaning rate for screen printing. In screen printing process, for cleaning process generally we will give up to 5(cleaning rate)depend upon the product. I need the cleaning rate specification for the above said. Need you
Electronics Forum | Thu Oct 17 14:36:30 EDT 2013 | hegemon
Hey SWAG, any idea where that Nano Protek goes, that you have to replace it? (and I am not talking about polishing up wheels) Is it being scrubbed off of the stencil during the print process, and over time it must be replenished? Sorry a bit off top
Electronics Forum | Wed Mar 04 21:24:04 EST 1998 | Ron Costa
Hello everyone! Does any know anything about bare board size variations? Is there a spec. or tolerance? I'm running small lots of boards and during the screen printing process I find that I cannot paste each board perfectly.I've tried other screen pr
Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny
Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu
Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
Electronics Forum | Thu Jun 12 04:22:00 EDT 2003 | gaoliangcheng
Hi, our factory is introducing the FPC process. I have some question to ask.Could anyone reply/ 1.how can we fix the FPC in the mounting and printing process? 2.how can we set up the temperature profile? Thanks.
Electronics Forum | Fri Jul 29 08:22:34 EDT 2011 | mskler
What will be the specifications of solder paste printing for 6 mil thikness in SnPbAg process. Also what will be the control limits fro X bar R chart. Thanks in advance for the help
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
