Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
Industry News | 2016-02-03 12:04:47.0
The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.
Industry News | 2013-01-29 11:50:31.0
Everett Charles Technologies’ (ECT today announced plans to exhibit in Booth #1913 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California
Industry News | 2018-01-16 17:25:38.0
The speed of change in the electronics industry is rapidly accelerating. The direction in which the industry moves is constantly shifting...and it needs participation, see you in San Diego! JTAG Technologies is excited to showcase here in San Diego the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB) layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.
Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Fri Apr 27 10:38:30 EDT 2007 | pjc
No dome needed. You should check what type probe you have. You can look here and consult with them: http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT
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