Electronics Forum | Mon Jun 07 15:00:42 EDT 2004 | Melissa
I am a student at Arizona State University working on my thesis which focuses on the packaging industry within the electronics industry supply chain. To better understand the processes, I was hoping someone could tell me where I could find some quic
Electronics Forum | Tue Jun 08 12:15:27 EDT 2004 | Melissa
I am a student at Arizona State University working on my thesis which focuses on the packaging industry within the electronics industry supply chain. To better understand the processes, I was hoping someone could tell me where I could find some quick
Electronics Forum | Fri Mar 07 04:25:29 EST 2008 | mun4o
Hi, i try to collect data for solder wave process defects, but I dont know how I must calculate these data.Can anyone help me - may be there nave some free software for this.I want to calculate how many ppm is our deffects.And, how is acceptable ran
Electronics Forum | Sat Apr 25 19:17:36 EDT 2009 | newtfly
Emilio, I have a fishbone diagram that I can e-mail to you that shows the MANY variables in the paste print process. There is only one way to determine for certain that the printer is doing it's job, and that is with a true 3D paste inspection proc
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Fri Mar 16 13:50:16 EST 2001 | mparker
Shadowing sounds about right to me also. Really dicey experiment to run if you are dropping expensive tantalums just to save a little coin in epoxy and processing time.
Electronics Forum | Wed Jun 10 11:21:04 EDT 1998 | Kelly Morris
Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. Example: Screen Print = 45% of total defects Component Placement = 25% of total defects
Electronics Forum | Fri Sep 13 02:27:21 EDT 2002 | jojojameson
kenbliss , We can give you a complete solution for installation,manufacturing & process control. Regards jojo jameson
