Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Electronics Forum | Wed Feb 08 12:23:12 EST 2006 | slthomas
Just to nitpick a little, collecting defect data and reacting to it really isn't an SPC function. Cal's recommendations (determine critical processes, assess process capability and acceptable limits) are spot on and are pretty much the definition of
Electronics Forum | Thu Aug 22 02:04:25 EDT 2002 | Bob Willis
I would talk to you suppier of placement equipmennt as Assembleon have experience with running odd form on machines as do Panasonic, Siemens, Mimot and Universal. I have run two lines with machines from your supplier and will be doing a project with
Electronics Forum | Tue Oct 07 11:45:59 EDT 2008 | ismir
Hi all! Got a question for you guys:) I'd like to measure if the grayscale of an AXI is stable or not. How shall I do it? Should I do a process capability study or is the X-bar chart-method better? Or is there a third method that I should use? What
Electronics Forum | Mon Jul 18 16:48:54 EDT 2005 | lupo
Hello, According with quality standards TS16949 ,QS 9000 etc. improvement can be perform when the process is stable and capable. So, if DOE is method for improvement it is a good idea, first to run SPC for investigation process stability and capa
Electronics Forum | Thu Feb 14 16:18:18 EST 2013 | davef
Adrianus: If your current reflow process is capable and in-control, don't change a thing. BR, davef
Electronics Forum | Wed Aug 21 17:24:23 EDT 2002 | EW
I am running capability evaluations on Dek printers with Cyber and LSM measurements. I spoke with "Phil" last year, but no standard method has been universally adopted. He had some good suggestions. We are currently selecting our own criteria and
Electronics Forum | Thu Jan 31 07:49:38 EST 2008 | cyber_wolf
"What do I Really Need" is a subjective question.It all depends on who you ask. I have been in small mom and pop shops that were running BGA's and they were doing some scary stuff.(I wont go into details) In order to put a correct process together y
Electronics Forum | Tue Jan 02 18:04:18 EST 2007 | russ
way too low of yield. with that technology on the board I would expect about 98% as well. So what are the defects? and more importantly, is your design, machine(s) and/or process(s) capable of this technology? Details I am sure are forthcoming R
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
