Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Mon Apr 16 18:49:40 EDT 2012 | tris101
Hi guys, I'm looking for some tooling parts and I hope you can point me in the right direction. We design basic in house reflow Carriers to surport boards during reflow. I would like to add clamps to our designs but I can not locate any off the she
Electronics Forum | Tue Jan 31 12:37:33 EST 2006 | carterhoward
I guess my biggest concern would be what will happen to the inner metallic layer of the leaded solder during the higher temperatures.
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Wed Feb 01 07:32:05 EST 2006 | Chunks
Try an intermediate paste like Loctite/Henkle 218. It's design is to be used in a mixed lead/lead-free process.
Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Tue Sep 16 15:47:05 EDT 2008 | ismir
Hello everyone! I'm a student of electrical engineering currently working on a thesis for my BSc degree. It will be about post reflow AOIs and AXIs, and I'd kindly like to ask you for some help with it. I would like to know if there are any standar
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