Electronics Forum: reflow defects (Page 5 of 54)

IC marking unclear after pass reflow

Electronics Forum | Tue Apr 01 09:46:26 EDT 2008 | patsama_n

Thank you for kindness advice. From the result of IC after pass the reflow process. The color of letter will change to similar color of material compound of IC. Then when we inspection by AOI machine, we have many problem about high fault reject rate

Wetting problem of PCB after reflow soldering

Electronics Forum | Fri Sep 14 15:31:02 EDT 2001 | davef

How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

Solder at top nexlev pin after reflow owen

Electronics Forum | Fri Aug 21 17:34:53 EDT 2009 | rajz

Need a help from friend, I got a issue that we face a defect that solder on nexlev pin after reflow owen.

Line release of post reflow AOI and AXI

Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon

Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t

What is the rootcause for BGA Lifted after reflow

Electronics Forum | Tue May 20 06:14:32 EDT 2008 | roc2x

Hi, Im qulifiying 2 PCB supplier and supplier A has no defect found but supplier B got 4 defective cards and 4 are same failure. 4 cards having lifted pad after reflow in same BGa location. I run the 2 PCb supplier in one reflow,using same profile,sa

Best test methods to qualify reflow ovens, automated optical inspection

Electronics Forum | Wed Dec 13 14:17:26 EST 2017 | emeto

For the ovens you run the profiler and you compare graphs. For the AOI you should run these golden boards(boards that you keep for AOI test - might have intentionally implemented defects) once in a while and make sure you are getting the same results

Best test methods to qualify reflow ovens, automated optical inspection

Electronics Forum | Thu Jan 04 03:01:38 EST 2018 | buckcho

As always, our good colleague Evtimov is right about the AOI and oven. For the AOI you need to make a golden sample board(panel) and test if your machine can catch all defects that you simulated BEFORE the oven. Try to me as accurate to real defects

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Re: Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup

Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM


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Surface Mount Technology Association (SMTA)
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