New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Industry News | 2008-01-23 10:09:33.0
OSAKA, JAPAN � January 22, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will be showcasing its SN100C products with FCT Assembly, one of its US SN100C Global Partners, in Booth 128 t the upcoming Electronics West exhibition, scheduled to take place January 29-31, 2008 in Anaheim, Calif.
Industry News | 2008-02-19 09:33:01.0
OSAKA, JAPAN � February 19, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering material to the global market, announces that it will be showcasing its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the upcoming Dallas SMTA Vendor Show, scheduled to take place March 5, 2008 from 10:30 a.m. to 3 p.m. at Richardson Civic Center in Dallas, Texas.
Industry News | 2008-02-22 16:44:29.0
OSAKA, JAPAN � February 21, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering material to the global market, announces that it will be showcasing its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the upcoming Houston SMTA Vendor Show, scheduled to take place March 7, 2008 from 12 to 5 p.m. at Sam Houston Race Park in Houston, Texas.
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Industry News | 2008-04-09 00:04:58.0
OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.
Industry News | 2009-04-13 16:28:45.0
ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2009-05-13 22:19:17.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, �Achieving High Reliability, Low Cost, Lead-Free SAC Solder Joints Via Mn or Ce Doping� at the 59th Electronic Components and Technology Conference (ECTC) held in San Diego, CA, May 26 - 29, 2009. He will also chair the professional development course, �Achieving High Reliability of Lead-Free Soldering � Materials Consideration� at the conference.
Industry News | 2014-08-28 11:46:07.0
Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition.
Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
