Technical Library | 2022-04-29 00:49:12.0
Tools: soldering iron, soldering iron stand, wet sponge, tweezers, rosin, solder, absorbent cotton, 95% alcohol, chip resistors, capacitors, circuit boards, 220V power supply..... http://www.leadersmt.com/gen2/1028113523/?mod=file&col_key=download
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
Technical Library | 2008-05-07 17:54:58.0
Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards.
Technical Library | 2021-11-22 20:39:44.0
Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%.
Technical Library | 2016-01-12 11:09:47.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
Technical Library | 2019-02-27 15:23:47.0
A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2009-11-18 23:37:52.0
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.
Technical Library | 2020-04-01 05:52:59.0
Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
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