Electronics Forum: solder and fountains (Page 5 of 114)

solder sphere and weight issues

Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson

I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 14:16:44 EST 2007 | realchunks

This is funny. Poeple giving answers to a question that isn't specific. What if the shorts he is having are on the top of his board, caused by flooding or Omega wave too high?

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto

I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.

Soldering robot and solder balls

Electronics Forum | Sat Jun 24 07:48:05 EDT 2017 | ranap121212

Thanks from your answer. A few days ago the supplier told me about these rolls. Now I am waiting for them and I will make tests. Maybe I will also try to reduce the ejection speed but this will lengthen the process

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc

5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

Palladium finish and solder balls

Electronics Forum | Fri Jun 28 04:10:24 EDT 2002 | robbied

Great, now at least I have an explanation of sorts. Thanks, Dave.

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 13:58:54 EST 2007 | ck_the_flip

I made my own wave measuring device using KIC2000 system. KIC2000 has automatic wave detection, so now I have a profiler for both reflow ovens and wave solder. The delmat carrier only cost $500. A guy, Samir, from this forum gave me the idea, actu


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