Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Tue Jul 31 20:55:36 EDT 2001 | davef
Just so that you know, the 5DX does laminography. Like the word lamination, laminography takes a series of short focal length xrays, each a little deeper than the previous. Microlaminography allows layer by layer information to be measured in 'slic
Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef
The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is
Electronics Forum | Thu Apr 21 10:34:06 EDT 2005 | patrickbruneel
Hi Y'all It would be valuable to the users of this forum to get a response from the original poster about his/her findings and solutions. It usually starts with the post of a problem, then opinions and experiences get exchanged but we never see a co
Electronics Forum | Fri Dec 16 06:46:12 EST 2005 | Rob
How about keeping a fridge near the line and only putting on the stencil what is needed, then topping up from the jar as & when? As soon as the paste hits the stencil flux will evapourate, and all of that time spent by people in labs developing comp
Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel
Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine
Electronics Forum | Wed Mar 04 08:21:42 EST 2009 | rgduval
It seems familiar, but nothing that I've actually experienced. I've read some articles about tin-whiskering in lead-free solder. I think NASA has some pretty good analysis (or, at least they did a couple of years ago). The summary is that without
Electronics Forum | Fri Jun 08 11:35:16 EDT 2007 | patrickbruneel
80-90% of an average SM component is non wetable (pushing away solder). So if you would use a single smooth lambda wave (massive amount of molten metal) the negative force of the non-wetable part of the component would be so high that the solder wou
Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN
I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp
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