Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Tue May 02 15:09:40 EDT 2006 | PWH
Just a few problems you might have to deal with: 1) Your bare boards must be clean and kept clean though-out the process. You could notice handling contamination that might otherwise have been removed in your wash. 2) You will see solder balls a
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc
Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't
Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Thu Jun 23 21:04:04 EDT 2005 | darby
If you have concluded that it is not a file storage problem you may wish to consider - When setting up a job the camera can move to virtually any position. This does not mean that the actuators on the stencil or board have enough travel to align the
Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas
Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?
Electronics Forum | Thu Jun 21 07:21:26 EDT 2007 | chrispy1963
5 mil is perfect for 0402's. If you are printing SnPb solder use apeture reduction such as home plating the pads. However, if youre using SAC, we've found that printing the entire pad works best due to poor wetting compared to SnPb paste. Chris
Electronics Forum | Tue Mar 30 06:27:22 EDT 2010 | ristikas
It happens on the middle of the stecil cleaning. The camera and the cleaner will stay under stencil in half way back. Then machine asking the initate the motors. If to press initate then the pcb stopper will hit the rails. Usually we move camera and
.gif)
