Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Tue Feb 12 15:48:40 EST 2013 | emeto
My appertures are 10mil diameter. Using electroformed stencil is probably be my next step. Thank you!
Electronics Forum | Thu Sep 02 05:37:49 EDT 1999 | Dreamsniper
I'd like to know the advantages and disadvantages between the two. Thanks and regards,
Electronics Forum | Thu Sep 15 10:43:18 EDT 2016 | claudea2
Thanks to Bobpan we re connected our wipe system and all the air actuators work fine. I still have a problem with the cleaner fluid dispenser. It is not moving as it should to dispense the liquid when we do the command. I suspect the values in the c
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Thu Sep 02 08:06:01 EDT 1999 | Wolfgang Busko
| | I'd like to know the advantages and disadvantages between the two. | | | | Thanks and regards, | | However, I really like aperture reduction best after running the experiment while using .006" thick foils as the practical limit. This really w
Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp
I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us
Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
Electronics Forum | Sun Apr 14 14:13:25 EDT 2002 | davef
I assume you're looking at stencil fab equipment because you need 'faster turns' than you can get from available stencil suppliers. While you're assessing this, consider other alternatives, such as: * Dispensing paste. [A very funny SMTNetter, livin
Electronics Forum | Mon Aug 12 21:54:33 EDT 2019 | davef
I've never seen successful printing with a step as deep as you seem to be saying. The keep out would have to be jigundous!!!! SMTnet Technical Library: https://smtnet.com/library/files/upload/Step-Stencils-laserjob.pdf I'd guess * Maximum step
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