The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices
SMTnet Express, September 11, 2014, Subscribers: 23214, Members: Companies: 14043, Users: 36809 Reliability of Reworked QFNs. Bob Wettermann; Business Electronics Soldering Technologies (BEST) Inc. Recently, the impact of leadless device
SMTnet Express, September 18, 2014, Subscribers: 23262, Members: Companies: 14045, Users: 36846 Predicting the Lifetime of the PCB - From Experiment to Simulation. Markus Leitgeb; AT&S , Peter Fuchs; PCCL Two major drivers in electronic
SMTnet Express, October 9, 2014, Subscribers: 23380, Members: Companies: 14083, Users: 36943 Cleaning Of Assembled PCBs - A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field Wilfried Clemens; Kolb Cleaning Technology
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030 Solder Joint Reliability Under Realistic Service Conditions. P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas
SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
SMTnet Express, November 13, 2014, Subscribers: 23528, Members: Companies: 14104, Users: 37155 Advanced Thermal Management Solutions on PCBs for High Power Applications Gregor Langer, Markus Leitgeb - Austria Technologie & Systemtechnik AG, Johann
SMTnet Express, September 4, 2014, Subscribers: 23183, Members: Companies: 14034, Users: 36770 Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead. U. Guin, M. Tehranipoor; ECE Department, University of Connecticut, D
